Together with two Fraunhofer Institutes, Airbus and Altran have developed demonstrators. Together, the companies are providing proof that printed electronics are ready for applications in aviation (photo: Airbus)

LOPEC 2019: Take off with printed electronics


Exhibitions / Events

Low weight, no need for cables and highly automated manufacturing of fully customised components: Printed electronics offers many advantages for the aviation industry. At the LOPEC Conference 2019, Dennis Hahn from aircraft manufacturer Airbus and Max Seissler from the consulting and technology company Altran will provide an overview of the special requirements placed on flying components. Based in Hamburg, Germany, they are cooperating on printed electronics for the aircraft cabin. In this interview they illustrate the challenges and visions.

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Ynvisible aims at packaging applications with its electrochromic displays (photo: Ynvisible)

Ynvisible’s displays to be used in the smart labels sector


Products

Ynvisible Interactive Inc. (Vancouver, Canada) has begun work on commercial contracts that are expected to reach market in 2019. The first two contracts are with leading companies in the field of smart labels and related verification and tracking services. In both cases, Ynvisible provides visual indicators to the clients' smart label solutions. One of the cases focuses on using an Ynvisible patented electrochromic solution and ink for an end application in the electronics sector.

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Cambrios seeks to invalidate one of C3Nano Inc.’s US patents in silver nanowire film technology (photo: https://www.maxpixel.net/Paragraphs-Magnifying-Glass-Paragraph-Horizontal-1005411 )

Cambrios files inter partes review seeking to invalidate C3Nano Inc.‘s core US patent in silver nanowire film technology


Companies / Markets

Cambrios Film Solutions Corporation (Sunnyvale, California), a leader in silver nanowire (SNW) technology, and owner of a comprehensive portfolio of SNW-related patents, filed a petition requesting an inter partes review (IPR) of C3Nano’s core US Patent 9,183,968 with the US Patent Trial and Appeal Board on 1 February 2019.

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A flexible ConnectIC wafer from PragmatIC (photo: PragmatIC)

PragmatIC launches ConnectIC family of ultra-low cost RFID ICs


Products

PragmatIC (Cambridge, UK), a leader in ultra-low cost flexible electronics, announces the first products in its ConnectIC family, the PR1101 and PR1102 flexible integrated circuits (FlexICs), designed for use in closed HF RFID systems. The ground-breaking ConnectIC family will be pivotal in the acceleration of the smart packaging market.

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Tactotek’s functional display panel; The PC hard coat film is second-surface printed with NORIPHAN XMR (photo: Pröll KG)

Pröll KG to showcase its portfolio at LOPEC 2019


Exhibitions / Events

Pröll KG from Weißenburg, Germany, will once again showcase its solutions for the printed electronics industry at LOPEC 2019, the leading European tradeshow for this sector.

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