Adam Kablanian, new CEO at CYNORA (photo: CYNORA)

OLED materials innovator CYNORA secures US$25M, names new CEO


Appointments

Marking the initial closing of its Series C funding round, CYNORA (Bruchsal, Germany) announced that it has secured US$25M in financing from investors in Asia, Europe and the US. The company is an emerging materials leader with a novel technology to produce ultra-high-efficiency emitter systems required for next-generation Organic Light Emitting Diode (OLED) displays. The company has raised US$80M since its inception in 2008. Final closing of the C round with an additional investment is expected shortly.

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Flexible electronic devices from C3Nano (photo: C3Nano Inc.)

C3Nano’s ActiveGrid ink qualified for mass production by Hitachi Chemical Company


Products

C3Nano Inc. (Hayward, California), a leader in silver nanowire-based transparent conductive inks and films used in flexible displays, touchscreens and other products, announced that Hitachi Chemical Company, Ltd. has qualified C3Nano’s ActiveGrid ink for mass production in its TCTF (transparent conductive transfer film) product. Additionally, Hitachi Chemical’s TCTF has been adopted in a major Chinese mobile flexible device and is expected to be integrated into several more flexible devices in 2019.

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A RAIN RFID label (photo: DELO)

DELO, Mühlbauer, and Impinj achieve milestone in efficient RAIN RFID label manufacturing


Companies / Markets

DELO Industrial Adhesives (Windach, Germany), Mühlbauer (Roding, Germany) and Impinj, Inc. (Seattle, Washington) have announced a new milestone in the effort to achieve high-volume inlay manufacturing. The three RAIN RFID industry leaders have successfully teamed to deliver DELO MONOPOX AC6545, supporting the high-speed assembly of copper-bonded RFID chips such as the Impinj Monza 6 family on Mühlbauer high speed assembly lines.

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An IMSE solution from TactoTek (photo: TactoTek)

Nagase to promote and distribute Tactotek’s IMSE technology in Japan


Companies / Markets

Recently, TactoTek announced that Nagase (Tokyo, Japan) signed an agreement to market and sell injection moulded structural electronics (IMSE) solutions in Japan. Nagase is one of Japan’s largest trading firms with a long history of introducing industry-leading products and technologies to the country’s commercial markets.

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Technology from Thinfilm (photo: Thinfilm)

BERICAP and Thinfilm partner to implement advanced closure technology


Companies / Markets

BERICAP (Budenheim, Germany), a supplier of world-class high value-added plastic caps and closures for food, beverage, pharmaceutical, and industrial markets, and Thin Film Electronics (San José, California), a leader in near field communications (NFC) solutions, have signed a letter of intent for an exclusive joint partnership to develop fully integrated digital authentication solutions for closures in over-the-counter pharmaceuticals and industrial applications.

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