Companies / Markets

The global semiconductor market is growing rapidly. The growth is driven by advancements in IoT, automotive and 5G requiring faster chips that use less power. EUV lithography is a giant leap forward, yet defects in printing remain the greatest constraint to EUV uptake. Silicon is reaching its physical limits too, calling for new material innovations to keep Moore’s Law on track.

Jabil Packaging Solutions, a division of Jabil Inc. (St. Petersburg, Florida), recently launched a connected packaging platform that enables consumer packaged goods (CPG) companies to offer their customers a compelling next-generation user experience that maximises convenience and boosts brand loyalty. The new platform combines sensors, connectivity and cloud technologies to eliminate reorder friction for consumer staples. Leveraging Jabil’s specialised services, differentiated capabilities and turnkey products for connected packaging innovation and scale, the platform positions the company as one of the only packaging solutions providers to offer connected packaging services across the entire value chain.