Companies / Markets

 

TactoTek signs recycling ecosystem partnership agreement with URT


Companies / Markets

TactoTek (Oulu, Finland), a leading provider of in-mould structural electronics (IMSE) technology, has signed a recycling ecosystem partnership contract with Universal Recycling Technologies, LLC (North-America). As a part of TactoTek’s sustainability approach and the objective to develop more environmentally friendly electronics, TactoTek is building a global recycling ecosystem. This development promotes efficient recycling of manufacturing waste and IMSE end-of-life parts. The partnership enables TactoTek’s licensees to recycle IMSE production-related electronics waste in an efficient, environmentally friendly, and sustainable way. The recycling is done by the partner companies in the Recycling Ecosystem.

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LG Display and Mercedes Benz forge cooperation to elevate premium automotive displays


Companies / Markets

LG Display (Seoul, Korea), a world-leading innovator of display technologies, will solidify its partnership with Mercedes-Benz and enhance the two companies’ cooperation on premium automotive displays.

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Latest research on electrochemical sensors using Canatu CNT


Companies / Markets

Canatu (Vantaa, Finland), boasts unique expertise in how to adapt carbon nanotubes (CNT) to different contexts and uses. In partnership with forerunners, they innovate breakthroughs with the potential to redefine industries. “Seeking new opportunities comes naturally to us, and our experts are continuously thinking ahead of what’s to come, expanding what is possible with nanocarbon,” the company stated in a recent press release.

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Brewer Science expands Vichy Manufacturing Center to support semiconductor growth


Companies / Markets

Brewer Science (Rolla, Missouri), a global leader in developing and manufacturing next-generation materials and products for the semiconductor industry, has celebrated the expansion of its Vichy Manufacturing Center with a ribbon-cutting ceremony. This momentous occasion is reported to mark a significant step forward in supporting the exponential growth projected for the semiconductor industry in the coming decade. The expansion of the Vichy Manufacturing Center, a substantial 50% increase in footprint, will be utilised for increased advanced manufacturing capacity, as well as expanded packaging and warehousing capabilities.

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Fraunhofer FEP – Paving the way for new ultra thin glass application


Companies / Markets

The processing of ultra-thin glass requires specialised handling to avoid glass breakage during production. Until now, this has been a major obstacle for the entry of this innovative material into new applications. Therefore, a unique process chain for ultra-thin glass processing has been implemented at Fraunhofer FEP (Dresden, Germany): starting with adapted cleaning processes up to the final inspection. The results have been funded within the project CUSTOM (grant no. AiF 21708 BR) by the German Federal Ministry of Economics and Climate Protection BMWK and the project Glass4Flex (grant no. 13N14615) funded by the German Federal Ministry of Education and Research BMBF.

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