Fraunhofer IAP’s pilot line for solution-based processes is located in a clean room and measures a lenght of 15 meters
Fraunhofer IAP’s pilot line for solution-based processes is located in a clean room and measures a lenght of 15 meters

New pilot line for organic electronics


Companies / Markets

The Fraunhofer Institute for Applied Polymer Research (IAP) in Postdam-Golm, Germany, has taken a new near-industrial scale pilot line for the development of organic light emitting diodes (OLEDs) in operation.

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  An image of a graphene molecule
An image of a graphene molecule

EU appoints Graphene as Emerging Technology Flagship


Companies / Markets

The European Commission has chosen so-called Graphene-project as one of Europe’s first two 10-year, 1 billion euro research flagships with the aim to take graphene and related layered materials from academic laboratories to society, revolutionise multiple industries and create economic growth and new jobs in Europe.

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  The Zero Energy Display (ZED)
The Zero Energy Display (ZED)

SERELEC and Plastic Logic present digital signage solution


Products

SERELEC, a supplier of digital signage headquartered in Lyon, France, and Plastic Logic, a company specialised in the development of flexible display technology, have collaborated in the development of a low-power outdoor digital signage solution based on Plastic Logic’s flexible plastic displays called ZED (Zero Energy Display).

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  Paul Heremans
Paul Heremans

New technology director Flexible Electronics at Holst Centre


Appointments

As per Januray 7, Paul Heremans has become technology director of the flexible electronics research activities at Holst Centre.

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  The conference will be held at MINATEC CAMPUS in Grenoble
The conference will be held at MINATEC CAMPUS in Grenoble

ICOE 2013 calls for papers


Exhibitions / Events

The 9th International Conference on Organic Electronics (ICOE), which will be staged in Grenoble from 18 to 20 June 2013 and is organised by the French institute CEA-LITEN, is calling for papers concerning the three main topics Materials, Process and Integration and Device Physics and Circuit design.

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