OLED microdisplays researched and developed at the Dresden Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP have already been offered for several years as evaluation kits for potential exploitation partners. In addition to the design of application- and customer-specific microdisplay chips made possible by means of integrated circuit design, the industry-compatible, standardised manufacturing process technology development up to testing and characterisation methods plays an important role. For the latter, a 64-device microdisplay test unit for characterisation upon delivery or/and receipt of goods by customers will now be presented for the first time at embedded world 2023 (14-15 March in Nuremberg, Germany), at the Fraunhofer joint booth (Hall 4, No. 422).
AIXTRON SE (Herzogenrath, Germany), a leading provider of deposition equipment to the semiconductor industry and ams OSRAM (Premstätten, Austria), a leader in optical solutions, announced that ams OSRAM has qualified AIXTRON AIX G5+ C and G10-AsP MOCVD systems on 200mm wafers for a Micro LED application.
Pixelligent Technologies (Baltimore, Maryland) appointed materials expert Jeff Anderson to its leadership team. As Vice President of Sales & Marketing, he is expected to build a global organisation to grow sales, deepen engagements with customers, and elevate the company’s brand worldwide. Pixelligent’s PixClear Designer Compounds are used by leaders to enable AR/MR/XR devices, OLED/Mini and MicroLED displays, optical/LIDAR sensors, and industrial applications. They are reported to deliver unprecedented efficiency, performance, and sustainability advantages.
