The recently launched KODOS project (“Konfektionierter Dünnglas-Verbund für optoelektronische Systeme”, Thin Glass Composites for Optoelectronic Systems), funded by the German Federal Ministry of Education and Research, is designed to transform thin glass into finished products along the entire value chain. The companies EMDE development of light, Volkswagen and Deutsche Werkstätten Hellerau, which focus on application development, have joined forces with the technology suppliers tesa, VON ARDENNE, Flabeg, 4JET microtech, SURAGUS, and the Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP (Dresden, Germany).
MICLEDI Microdisplays, the latest spin-off of imec (Leuven, Belgium), has raised €4,5M seed capital from imec.xpand, with participation of PMV and FIDIMEC. The funding will be used to develop microLED displays for next generation Augmented Reality (AR) glasses.
E Ink Holdings (Billerica, Massachusetts), an innovator of electronic ink technology, and LivingPackets (Pully, Switzerland), a creator of revolutionary reusable packaging, have announced THE BOX, a sustainable, reusable packaging solution for businesses and consumers.