Recently, TactoTek announced that Nagase (Tokyo, Japan) signed an agreement to market and sell injection moulded structural electronics (IMSE) solutions in Japan. Nagase is one of Japan’s largest trading firms with a long history of introducing industry-leading products and technologies to the country’s commercial markets.
In March, LOPEC took place in Munich with about 160 international companies. They used the opportunity to present a full range of products and solutions for organic and printed electronics, from research to market launch. For Lohmann’s (Neuwied, Germany) bonding engineers, too, printed electronics is a promising market which offers innovative product possibilities. Consumer goods & electronics, transportation, medical, intelligent textiles and packaging are the main focuses of printed electronics – areas in which Lohmann has decades of experience.
Bö-La (Radevormwald, Germany) and TactoTek (Oulu, Finland) jointly announced that they have signed an agreement for BÖ-LA to market and sell injection moulded structural electronics (IMSE) solutions. This partnership brings together leaders in their respective technology domains to advance the market for integrating electronic functionality within moulded plastics.