In March, LOPEC took place in Munich with about 160 international companies. They used the opportunity to present a full range of products and solutions for organic and printed electronics, from research to market launch. For Lohmann’s (Neuwied, Germany) bonding engineers, too, printed electronics is a promising market which offers innovative product possibilities. Consumer goods & electronics, transportation, medical, intelligent textiles and packaging are the main focuses of printed electronics – areas in which Lohmann has decades of experience.
Bö-La (Radevormwald, Germany) and TactoTek (Oulu, Finland) jointly announced that they have signed an agreement for BÖ-LA to market and sell injection moulded structural electronics (IMSE) solutions. This partnership brings together leaders in their respective technology domains to advance the market for integrating electronic functionality within moulded plastics.
Sensors for medical applications, smart textiles and OLEDs for the automotive industry: numerous industries rely on printed and flexible electronics in their innovation process. LOPEC, the international exhibition and conference for the printed electronics industry, which took place from 19 to 21 March in Munich, Germany, reflects this trend. Science and industry provided important stimuli to the subject of mobility with the future topic of 3D structural electronics.