News (Printed electronics)


Meyer Burger divests its wafering business to Precision Surfacing Solutions

Meyer Burger Technology Ltd (Thun, Switzerland) recently announced that it will sell its photovoltaic and specialised materials (e.g. semiconductor and sapphire glass industries) wafering equipment and service business to Precision Surfacing Solutions (PSS) (formerly Lapmaster Wolters Ltd), a global supplier of equipment and services for surface enhancement technology. As part of the transaction, significant parts of Meyer Burger’s current production facilities in Thun as well as around 100 employees involved in the wafering technology portfolio in Thun and the relevant service locations worldwide will also be transferred to PSS.


Revathi Advaithi, new CEO at Flex (photo: Flex)

Flex appoints new CEO

Flex (San José, California), a sketch-to-scale solutions provider that designs and builds intelligent products globally, announced that Revathi Advaithi, 51, has been named CEO and appointed to the board of directors at Flex.


Together with two Fraunhofer Institutes, Airbus and Altran have developed demonstrators. Together, the companies are providing proof that printed electronics are ready for applications in aviation (photo: Airbus)

LOPEC 2019: Take off with printed electronics

Low weight, no need for cables and highly automated manufacturing of fully customised components: Printed electronics offers many advantages for the aviation industry. At the LOPEC Conference 2019, Dennis Hahn from aircraft manufacturer Airbus and Max Seissler from the consulting and technology company Altran will provide an overview of the special requirements placed on flying components. Based in Hamburg, Germany, they are cooperating on printed electronics for the aircraft cabin. In this interview they illustrate the challenges and visions.


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