The recently launched KODOS project (“Konfektionierter Dünnglas-Verbund für optoelektronische Systeme”, Thin Glass Composites for Optoelectronic Systems), funded by the German Federal Ministry of Education and Research, is designed to transform thin glass into finished products along the entire value chain. The companies EMDE development of light, Volkswagen and Deutsche Werkstätten Hellerau, which focus on application development, have joined forces with the technology suppliers tesa, VON ARDENNE, Flabeg, 4JET microtech, SURAGUS, and the Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP (Dresden, Germany).
CES 2020 opened on 7 January unveiling the next generation of innovation that is expected to redefine industries, create jobs and solve many of society’s challenges. With more than 4400 exhibiting companies, including 1200 start-ups, CES 2020 featured the latest transformative technologies, including 5G, artificial intelligence, vehicle technology, digital health and more.
Researchers from Holst Centre (Eindhoven, The Netherlands) have become the first to use spatial atomic layer deposition (sALD) to create both the semiconductor and dielectric layer in a thin-film transistor (TFT) backplane. Using a low-temperature, large-area process for the backplane, the team created a 200 ppi QVGA display demonstrator. The process allows TFTs to be produced on cheaper, transparent plastic foils, significantly reducing the cost of flexible electronics applications such as displays and image sensors. To showcase the technology, Holst Centre has produced a display demonstrator using a backplane of top-gated self-aligned TFTs on a PEN foil.