With its three-day Conference, LOPEC, the international exhibition for printed electronics, is bridging the gap between science and industry. From 19 to 21 March 2019, manufacturers, users and researchers from all over the world will meet in Munich to discuss innovations and trends in printed electronics.
Low weight, no need for cables and highly automated manufacturing of fully customised components: Printed electronics offers many advantages for the aviation industry. At the LOPEC Conference 2019, Dennis Hahn from aircraft manufacturer Airbus and Max Seissler from the consulting and technology company Altran will provide an overview of the special requirements placed on flying components. Based in Hamburg, Germany, they are cooperating on printed electronics for the aircraft cabin. In this interview they illustrate the challenges and visions.