News (LOPEC)

3D structural electronics will play a major role at LOPEC 2019 (photo: Messe München)

LOPEC 2019: A new dimension of mobility with 3D structural electronics

Whether it is sensors, lights or displays: More and more electronic components in the automotive sector are being printed. And there are no limits to the design. From 19 to 21 March 2019, LOPEC in Munich will provide information about new developments and trends on the market for printed electronics. One focus of the international exhibition and the accompanying conference will be on applications in the automotive industry.


LOPEC and the OE-A will showcase the opportunities in printed electronics at electronica (photo: Messe München)

LOPEC and OE-A at electronica: Printed electronics as perfect complement to semiconductors

In November, the world of electronics comes together in Munich, Germany, at electronica, the world's leading exhibition and conference for electronics. LOPEC, the international exhibition and conference for the printed electronics industry, will also be represented at the event and present the current state of the technology together with the OE-A (Organic and Printed Electronics Association). During the afternoon of two exhibition days, the PCB Marketplace Forum will be dedicated to printed electronics. A comprehensive overview of the entire value chain in this industry will be presented by LOPEC in Munich—the next edition taking place from 19 to 21 March 2019.


LOPEC will be back in Munich next March (photo: Messe München)

LOPEC 2019 and smart packaging: Printed electronics as growth driver

When pharmaceutical packages sound an alarm or food cartons measure the temperature, printed electronics are involved. LOPEC, the international exhibition and conference for the PE industry in Munich, Germany, will provide information on next generation packaging from 19-21 March 2019.


Event diary

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