Optomec (Albuqerque, New Mexico), a leading global supplier of production grade additive manufacturing systems for 3D printed metals and 3D printed electronics, recently announced it signed a distribution agreement with Tesscorn Nano Science, Inc. to expand sales of its solutions into India. Tesscorn is a leading distributor of integrated products, services, and support to the research and development community in India including defence, aerospace, automotive, military forces and universities.
In the last few years several brands have experimented with NFC enabled smart packaging, but these trials have primarily been in low volume marketing campaigns. A significant reduction in cost is required to progress to high volume, mass market roll out.
Working hand in hand with 18 partner companies, Siemens AG is founding “MindSphere World”, a worldwide user organisation for the cloud-based open IoT operating system MindSphere. Its aim is to expand the global reach of the ecosystem based on MindSphere. The organisation is also designed to afford support to its individual members in developing and improving IoT solutions on the MindSphere platform and in tapping new markets in the digital economy.