News (Conference and Exhibition)

 
Fraunhofer researchers intend to develop a methodology that combines biotechnology processes with low-energy electron-beam technology (photo: Fraunhofer FEP)

Fraunhofer FEP: Use of low-energy electrons for innovative biotechnology processes

The Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP (Dresden, Germany) has been utilising electron-beam technology for decades in the development of cleaning, sterilisation, and surface-modification processes and systems. Fraunhofer researchers from the Medical and Biotechnological Applications division (MBA) now intend to develop a methodology that combines biotechnology processes with low-energy electron-beam technology. Moreover, this hybrid methodology will be combined with existing FEP expertise in the area of sensor technology. The anticipated research programme will be presented at the MedtecLIVE trade show in Nuremberg, Hall 10, Booth No. 10.0.513, taking place from 31 March – 2 April 2020.

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The clean room facilities at TactoTek (photo: TactoTek)

Marquardt and TactoTek collaborate on IMSE solution for leading automotive OEM

TactoTek (Oulu, Finland) and Marquardt are developing an injection-moulded structural electronics (IMSE) solution for a leading automotive OEM in their first collaboration project. The pre-development project is for a specific vehicle family and includes full automotive validation of the IMSE parts.

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At the end of January, PRINSE’20 was held in Oulu, Finland (photo: PrintoCent)

PRINSE’20 – 6th printed intelligence industry seminar organised successfully by PrintoCent

The PrintoCent community has organised the world’s biggest theme week around printed intelligence. Main event of the week was the PRINSE’20 seminar, which covered topics including eco-efficiency and sustainability, structural electronics, intelligent diagnostics and the emerging capacity growth in roll-2-roll manufacturing industry with over 60 industry speakers.

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Event diary

12-13
June

TechBlick Boston

The Future of Electronics RESHAPED

UMass Boston, USA

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