Hybrid electronics integration by inkjet technology: DoMicro at IDTechEx Show Berlin
DoMicro BV from The Netherlands has progressed in advanced packaging and integration of conventional electronics in flexible foil structures. Printing multi-layers, passive components and interconnection of thinned silicon dies is enabled by revolutionary developments in nano-printing and specific inkjet technology. Several samples will be discussed at the company’s booth T18 at IDTechEx 2019 in Berlin.
As managing director for DoMicro, Marcel Grooten drives the industrialisation of new production technology for flexible hybrid electronics. His company creates value through additive technologies for printed electronics and develops cutting edge inkjet printing processes. They deliver R&D services, small series production, system architecture and project management – typically for customers exploring new technologies for circuitry on flexible substrates like transparent conductive films, OPV, electrodes, OLED, Lab-on-chip, wearables, IC and MEMS integrations.
Caption: DoMicro will showcase its solutions for printed and hybrid electronics at IDTechEx Show Berlin (photo: DoMicro)