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Ynvisible aims at packaging applications with its electrochromic displays (photo: Ynvisible)

Ynvisible’s displays to be used in the smart labels sector


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Ynvisible Interactive Inc. (Vancouver, Canada) has begun work on commercial contracts that are expected to reach market in 2019. The first two contracts are with leading companies in the field of smart labels and related verification and tracking services. In both cases, Ynvisible provides visual indicators to the clients' smart label solutions. One of the cases focuses on using an Ynvisible patented electrochromic solution and ink for an end application in the electronics sector.

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A flexible ConnectIC wafer from PragmatIC (photo: PragmatIC)

PragmatIC launches ConnectIC family of ultra-low cost RFID ICs


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PragmatIC (Cambridge, UK), a leader in ultra-low cost flexible electronics, announces the first products in its ConnectIC family, the PR1101 and PR1102 flexible integrated circuits (FlexICs), designed for use in closed HF RFID systems. The ground-breaking ConnectIC family will be pivotal in the acceleration of the smart packaging market.

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Fraunhofer FEP’s OLED on silicon sensor (photo: Fraunhofer FEP)

Fraunhofer FEP: Blue OLED on silicon sensor detects phosphorescence


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The Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP (Dresden, Germany) has been involved in development of OLED-on-silicon sensors for years. The researchers have recently developed a miniaturised phosphorescence sensor that combines a marker and sensor on very small chip surface that could be produced at low cost in the long term. Researchers will present the first prototype of the sensor, which is currently designed for oxygen ratio monitoring, at embedded world 2019, 26-28 February in Nuremberg, Germany.

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