Companies / Markets

 

Fraunhofer FEP: Integrable system traverse for innovative 2D inline process monitoring


Companies / Markets

The coating of flexible substrates such as ultra-thin glass or web with functional layers is highly efficient thanks to the use of roll-to-roll (R2R) technologies. Crucial for plant operators and ultimately for the price is the coating thickness homogeneity and thus also the electrical properties of the applied coatings for a high and above all constant yield without rejects. Until now, the electrical properties of the coating could only be determined and analysed at defined measuring points. Within the joint project KODOS – Fabricated Thin Glass Composite for Optoelectronic Systems (funding reference 13N14607), funded by the German Federal Ministry of Education and Research, an integrable solution for in-line process monitoring and mapping of process parameters was developed with the project partner SURAGUS GmbH at Fraunhofer FEP in Dresden, Germany.

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German federal government and Bavaria commit support to ams OSRAM for groundbreaking semiconductor technology


Companies / Markets

ams OSRAM (Premstätten, Austria), a global leader in intelligent sensors and emitters, received notice of substantial public funding by the German federal government (i.e. the Federal Ministry for Economic Affairs and Climate Action) and the Free State of Bavaria. The funding is intended to boost the further development of semiconductor technology. The envisaged IPCEI funding (Important Project of Common European Interest) will support ams OSRAM in making its own investments in the research and development of innovative optoelectronic components at its Regensburg location.

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TactoTek: International Electrotechnical Commission (IEC) publishes first standard on in-mould electronics


Companies / Markets

The International Electrotechnical Commission (IEC)  has published the first standard “63899-202-10: Printed Electronics – Materials – Resistance measurement on thermoformable conducting” providing the printed electronics industry a standardised way to characterise the material. Finnish Structural Electronics pioneer TactoTek has led the standard development project that is part of the Technical Committee (TC119) activities. First proposed by TactoTek, the development project initiated in 2019 has now resulted in this standard, which enables injection moulded structural electronics (IMSE) designers to create optimised designs with standardised materials.

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Brewer Science releases Impact Report 2023


Companies / Markets

Brewer Science (Rolla, Missouri), a global leader in developing and manufacturing next-generation materials and products for the semiconductor industry, releases its Impact Report 2023, detailing the company’s efforts in sustainability, social responsibility, and governance.

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Axithra, a spin-off of imec and Ghent University, raises €10M


Companies / Markets

Axithra, a new spin-off of imec (Leuven, Belgium) and Ghent University, announced a 10 million euro seed round, securing the first two years of R&D. Axithra develops a technology platform for therapeutic drug monitoring (TDM) to quickly and accurately measure drug concentrations in a patient’s blood.

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