Thinfilm’s NFC SpeedTap solution (photo: Thinfilm)

Tapi and Thinfilm announce strategic partnership to enable smart closures

Companies / Markets

Tapì Group (Massanzago, Italy), specialised in the design, production, and distribution of high-end technological closures for the premium beverage sector, and Thin Film Electronics ASA (San José, California), a leader in near field communications (NFC) solutions, have signed a letter of intent for an exclusive joint partnership to combine their industry-leading innovation capabilities to better serve the needs of the wine and spirits industry.


From left: Dr Georg Bernatz, Merck; Dr Alain Schumacher, IEE; Thomas Kolbusch, Coatema; Stan Farnsworth, NovaCentrix; Richard Ellinger, American Semiconductor; Corinne Versini, Genes'ink; Dr Ton van Mol, Holst Centre; Dr Guido van Tartwijk, Heliatek; Prof

OE-A elects new international board of directors


The members of the OE-A (Organic and Printed Electronics Association) appointed Stan Farnsworth, NovaCentrix, as the new chairman of the board of directors, during the annual general assembly in Munich, Germany. Dr Xioalin Yan, Guangdong JUHUA Printing, is confirmed as vice chairman for Asia. Dr Alain Schumacher, IEE, and Richard Ellinger, American Semiconductor, are elected in their positions as Vice Chairman Europe and North America respectively.


Evonik’s printed batteries could play a major role in IoT applications (photo: Evonik)

Batteries from the printer: Evonik’s new technology at LOPEC 2019


Evonik Industries AG (Essen, Germany) has unveiled TAeTTOOz, a new material technology for printable batteries, at the LOPEC 2019 tradeshow that recently took place in Munich. TAeTTOOz has been developed on the basis of what are known as redox polymers by Creavis, the strategic innovation unit of Evonik.


The next LOPEC will take place from March 24 to 26, 2020 (photo: Messe München)

LOPEC 2019: Printed electronics is conquering numerous application sectors

Exhibitions / Events

Sensors for medical applications, smart textiles and OLEDs for the automotive industry: numerous industries rely on printed and flexible electronics in their innovation process. LOPEC, the international exhibition and conference for the printed electronics industry, which took place from 19 to 21 March in Munich, Germany, reflects this trend. Science and industry provided important stimuli to the subject of mobility with the future topic of 3D structural electronics.


In-line material characterisation and analysis technology developed for the European Smartonics project. The centre unit is the Raman head and the units either side are part of the ellipsometer. The instrumentation is mounted on a gantry that moves backwa

HORIBA announces successful implementation of spectral ellipsometry and Raman spectroscopy in roll-to-roll manufacturing scenarios


HORIBA (Kyoto, Japan), a world-renowned OEM of instruments and measurement systems, has successfully implemented in-line, non-destructive, non-intrusive and non-contact material analysis and characterisation techniques into roll-to-roll printed electronics manufacturing to provide quality assurance and improve yield.