Cambrios seeks to invalidate one of C3Nano Inc.’s US patents in silver nanowire film technology (photo: )

Cambrios files inter partes review seeking to invalidate C3Nano Inc.‘s core US patent in silver nanowire film technology

Companies / Markets

Cambrios Film Solutions Corporation (Sunnyvale, California), a leader in silver nanowire (SNW) technology, and owner of a comprehensive portfolio of SNW-related patents, filed a petition requesting an inter partes review (IPR) of C3Nano’s core US Patent 9,183,968 with the US Patent Trial and Appeal Board on 1 February 2019.


A flexible ConnectIC wafer from PragmatIC (photo: PragmatIC)

PragmatIC launches ConnectIC family of ultra-low cost RFID ICs


PragmatIC (Cambridge, UK), a leader in ultra-low cost flexible electronics, announces the first products in its ConnectIC family, the PR1101 and PR1102 flexible integrated circuits (FlexICs), designed for use in closed HF RFID systems. The ground-breaking ConnectIC family will be pivotal in the acceleration of the smart packaging market.


Tactotek’s functional display panel; The PC hard coat film is second-surface printed with NORIPHAN XMR (photo: Pröll KG)

Pröll KG to showcase its portfolio at LOPEC 2019

Exhibitions / Events

Pröll KG from Weißenburg, Germany, will once again showcase its solutions for the printed electronics industry at LOPEC 2019, the leading European tradeshow for this sector.


Mark Majewski, intelliFLEX CEO (photo: intelliFLEX)

intelliFLEX appoints new CEO


The intelliFLEX Innovation Alliance announced that Mark Majewski, a 30-year veteran of the Canadian technology industry and former geographic director at a major semiconductor company, has succeeded Peter Kallai as CEO. Majewski has extensive experience in the electronics and technology industries in Canada, having overseen the generation of hundreds of millions of dollars at STMicroelectronics while running its East Central U.S. and Canada regions.


Fraunhofer FEP’s OLED on silicon sensor (photo: Fraunhofer FEP)

Fraunhofer FEP: Blue OLED on silicon sensor detects phosphorescence


The Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP (Dresden, Germany) has been involved in development of OLED-on-silicon sensors for years. The researchers have recently developed a miniaturised phosphorescence sensor that combines a marker and sensor on very small chip surface that could be produced at low cost in the long term. Researchers will present the first prototype of the sensor, which is currently designed for oxygen ratio monitoring, at embedded world 2019, 26-28 February in Nuremberg, Germany.