News (LOPEC)

Direct printing of complex 3D moulded interconnect devices from Neotech AMT offer many advantages (photo: Neotech AMT)

LOPEC 2018: 3D-printed circuits and more

Printed electronics and 3D-printing systems are coming together and enabling new applications. The current state of this technology and its potential are a hot topic at LOPEC, the international exhibition and conference for the printed-electronics industry, which will be held from 13 to 15March 2018, at the Messe München exhibition grounds (Munich, Germany).


NFC tags from Thin Film can provide information about the product (photo: Thin Film)

LOPEC 2018 and drinktec 2017: Intelligent packaging for the beverage industry

The global market for intelligent packaging with printed electronic components is growing rapidly. Messe München is focusing on this topic with two events: drinktec, the world’s leading trade fair for the beverage and liquid food industry, will take place from 11 to 15 September 2017. The drinktec Forum on 14 September will provide information about printed electronics applications in the beverage industry. LOPEC, the international exhibition and conference for the printed electronics industry, will then take place six months later from 13 to 15 March 2018 and will focus, among other things, on smart packaging.


A broad, international audience - ranging from printed electronics experts to end-user industries (photo: Messe München)

Call for papers LOPEC 2018

To continue LOPEC’s successful printed electronics Conference Programme and to keep on the high level of extensive and informative presentations on the current state of the art, the organisers of LOPEC again offer the opportunity to make contributions for a fruitful LOPEC 2018. This time the focus topics will be Medical & Wellbeing and Automotive & Vehicle.


Event diary

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