News (IoT)

 
Smart packaging & IoT will be the main topics of the OE-A and EPSCRC event in Cambridge on 12 October (photo: OE-A)

OE-A and EPSRC to host “Printed Electronics Insights: Smart Packaging & IoT“ event in Cambridge

Together with the EPSRC Centre for Innovative Manufacturing in Large-Area Electronics / University of Cambridge, the OE-A (Organic Electronics Association) is organising “Printed Electronics Insights: Smart Packaging & IoT” – a day of presentations and a panel-discussion, co-sponsored by FlexTech.

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Source: TOPPAN FORMS

TOPPAN FORMS establishes technology for forming 4µm wide printed wires

The digital hybrid company TOPPAN FORMS Co., Ltd. (Tokyo, Japan) has developed a technology for forming printed micro wires, which enables a wire width of 4μm that is almost invisible to the naked eye. The company has established this technology by combining a conductive ink for micro wiring (silver salt ink) and a corresponding printing process technology. The new technology can be used for transparent electrodes for touch sensor panels, wearable sensors, sensors for the Internet of Things (IoT), and similar devices.

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An OPV module from Eight19 (photo: Eight19)

Eight19 secures £1.3M funding

The organic photovoltaic experts from Eight19 (Cambridge, UK) have announced that they have received a further £1.3M of investment. Lucros Investment (Netherlands) joined existing investors IP Group, Clarium and Providence in the round.  The new investment follows two years of continued improvement in OPV performance, advances in manufacturing readiness and an increased engagement with customers in the retail, FMCG and IoT sectors.

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