News (IoT)

 
SmartLabel enables consumers access to product information (photo: SmartLabel)

SmartLabel gets advanced digital product lifecycle management with EVRYTHNG

EVRYTHNG, the New York and London-based Internet of Things smart products platform, has announced its ability to support the SmartLabel transparency initiative, enabling consumer goods companies to easily participate in the programme, as well as to rapidly web-enable their products at scale and implement new digital applications across the product lifecycle.

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Smart packaging & IoT will be the main topics of the OE-A and EPSCRC event in Cambridge on 12 October (photo: OE-A)

OE-A and EPSRC to host “Printed Electronics Insights: Smart Packaging & IoT“ event in Cambridge

Together with the EPSRC Centre for Innovative Manufacturing in Large-Area Electronics / University of Cambridge, the OE-A (Organic Electronics Association) is organising “Printed Electronics Insights: Smart Packaging & IoT” – a day of presentations and a panel-discussion, co-sponsored by FlexTech.

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Source: TOPPAN FORMS

TOPPAN FORMS establishes technology for forming 4µm wide printed wires

The digital hybrid company TOPPAN FORMS Co., Ltd. (Tokyo, Japan) has developed a technology for forming printed micro wires, which enables a wire width of 4μm that is almost invisible to the naked eye. The company has established this technology by combining a conductive ink for micro wiring (silver salt ink) and a corresponding printing process technology. The new technology can be used for transparent electrodes for touch sensor panels, wearable sensors, sensors for the Internet of Things (IoT), and similar devices.

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