E Ink is awarded the world’s first ePaper module carbon footprint verification


Companies / Markets

E Ink (Billerica, Massachusetts), the originator, pioneer, and global commercial leader in digital paper technology, recently announced that the carbon footprint of their 6.8 inch ePaper module for eReaders and their 2.9 inch ePaper module for electronic shelf labels (ESL) have been verified by the British Standards Institution (BSI), as being in compliance with the ISO 14067:2018 standard. The carbon footprint of every 6.8 inch ePaper module is 3.30 kg CO2; every 2.9 inch ePaper module is 0.59 kg CO2e.

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Profile Plastics licenses TactoTek technology creating complete North American IMSE supply ecosystem


Companies / Markets

Profile Plastics (Chanhassen, Minnesota) has become a TactoTek (Oulu, Finland) Design & Innovate licensee, with rights to design and produce in-mould structural electronics (IMSE) solutions that use TactoTek intellectual property, and creating a complete IMSE supply ecosystem in North America.

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Nano start-up SALD opens up to investors


Companies / Markets

SALD BV (Eindhoven, The Netherlands), a specialist in the surface technology "Spatial Atomic Layer Deposition" (SALD), is opening up to investors for the first time. "We have largely completed the technological development, achieved first commercial successes on the world market and are now ready to accelerate growth through outside capital," says CEO Frank Verhage.

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LG Display unveils innovative OLED technologies at K-Display 2022


Exhibitions / Events

LG Display, the world’s leading innovator of display technologies, has demonstrated its cutting-edge OLED technologies at K-Display 2022, the KDIA’s (Korea Display Industry Association) largest display exhibition, in Seoul, Korea, between 10-12 August.

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InnovationLab demonstrates breakthrough PCB production method based on additive manufacturing


Companies / Markets

InnovationLab (Heidelberg, Germany), the expert in printed electronics "from lab to fab", has achieved a breakthrough in additive manufacturing of printed circuit boards (PCBs), helping meet higher environmental standards for electronics production while also reducing costs.

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