PI-SCALE’s design competition will announce its Grant Winner on 14 November 2017 (photo: PI-SCALE)

PI-SCALE announces Flexible OLED Design Competition 2017


Exhibitions / Events

The OLED Design Competition hosted by the European pilot line initiative PI-SCALE invites designer proposals for organic light-emitting diode (OLED) lighting and signage applications that highlight the special features of OLED technology: foldable, twistable, bendable, conformable, transparency, large area illumination.

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Chuck Milligan, CEO of FlexEnable (left) and Dr James Wong, COO and group executive director of Truly (right) (photo: FlexEnable)

Truly and FlexEnable sign license agreement to bring low-cost, scalable flexible display production to China


Companies / Markets

FlexEnable (Cambridge, UK), a leader in the development and industrialisation of organic electronics for flexible displays and sensors, has signed a technology transfer and license agreement with Truly Semiconductors (Guangdong, China), one of the leading display makers in China. The deal aims to bring FlexEnable’s flexible organic liquid crystal display (OLCD) technology into mass production on Truly’s lines within 2018.

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Smart packaging & IoT will be the main topics of the OE-A and EPSCRC event in Cambridge on 12 October (photo: OE-A)

OE-A and EPSRC to host “Printed Electronics Insights: Smart Packaging & IoT“ event in Cambridge


Exhibitions / Events

Together with the EPSRC Centre for Innovative Manufacturing in Large-Area Electronics / University of Cambridge, the OE-A (Organic Electronics Association) is organising “Printed Electronics Insights: Smart Packaging & IoT” – a day of presentations and a panel-discussion, co-sponsored by FlexTech.

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Prof Ruyan Guo and the newly installed F-Series at UTSA’s MeMDRL (photo: CERADROP)

The University of Texas at San Antonio acquires CERADOP’s hybrid 3D digital deposition platform


Companies / Markets

CERADROP (Limoges, France), a MGI Group company which designs and markets materials deposition digital printers exclusively for printed electronics and smart 3D printing, has announced that the University of Texas at San Antonio (UTSA) will strengthen its multifunctional electronic materials and devices research with the acquisition of a CERADROP Hybrid 3D Digital Deposition platform.

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Source: TOPPAN FORMS

TOPPAN FORMS establishes technology for forming 4µm wide printed wires


Products

The digital hybrid company TOPPAN FORMS Co., Ltd. (Tokyo, Japan) has developed a technology for forming printed micro wires, which enables a wire width of 4μm that is almost invisible to the naked eye. The company has established this technology by combining a conductive ink for micro wiring (silver salt ink) and a corresponding printing process technology. The new technology can be used for transparent electrodes for touch sensor panels, wearable sensors, sensors for the Internet of Things (IoT), and similar devices.

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